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ORCIDJianfeng Li 0002
Person information
- affiliation: University of Nottingham, Department of Electrical and Electronic Engineering, UK
Other persons with the same name
- Jianfeng Li — disambiguation page
- Jianfeng Li 0001
![[0000-0003-1161-2136]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-1161-2136")
— Hohai University, College of Computer and Information, Array and Information Processing Laboratory, Nanjing, China (and 1 more) - Jianfeng Li 0003 — Southwest University, School of Electronic and Information Engineering, Chongqing, China (and 1 more)
- Jianfeng Li 0004 — Beijing University of Posts and Telecommunications, Teleconm Engineering School, China
- Jianfeng Li 0005 — University of Science and Technology of China, China
- Jianfeng Li 0006 — Xi'an Jiaotong University, Faculty of Electronic and Information Engineering, MOE Key Laboratory for Intelligent Networks and Network Security, Xi'an, China (and 2 more)
- Jianfeng Li 0007 — Beijing University of Technology, Faculty of Materials and Manufacturing, Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing, China (and 1 more)
- Jianfeng Li 0008 — Beijing Aeronautical Technology Research Center, Beijing, China (and 1 more)
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2010 – 2019
- 2018
[j5]Jianfeng Li, Jingru Dai, Christopher Mark Johnson:
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectron. Reliab. 84: 55-65 (2018)- 2016
- [j4]Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson:
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59: 126-133 (2016) - 2015
- [j3]Imran Yaqub, Jianfeng Li, Christopher Mark Johnson:
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectron. Reliab. 55(12): 2596-2605 (2015) - 2013
- [j2]Robert Skuriat, Jianfeng Li, Pearl A. Agyakwa, Nevil Mattey, Paul Evans, C. Mark Johnson:
Degradation of thermal interface materials for high-temperature power electronics applications. Microelectron. Reliab. 53(12): 1933-1942 (2013) - 2011
- [j1]Pearl A. Agyakwa, Martin R. Corfield, Li Yang, Jianfeng Li, V. M. F. Marques, C. Mark Johnson:
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectron. Reliab. 51(2): 406-415 (2011)
Coauthor Index
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