"Processing quality results for electroless/electroplating of high-aspect ..."

Sam Siau et al. (2005)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2004.07.009

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/SiauBCHT05
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SiauBCHT05
Sam Siau, Johan de Baets, André Van Calster, Leon Heremans, Sammy Tanghe:
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectron. Reliab. 45(3-4): 675-687 (2005)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.