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ORCIDJohan de Baets
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2020 – today
- 2020
[c3]Bogdan C. Raducanu, Samira Zali Asl, Stefano Stanzione, Chris van Liempd, Andrés Vásquez Quintero, Herbert De Smet
, Johan de Baets, Chris Van Hoof, Nick Van Helleputte:
An Artificial Iris ASIC with High Voltage Liquid Crystal Driver, 10 nA Light Range Detector and 40 nA Blink Detector for LCD Flicker Removal. VLSI Circuits 2020: 1-2
2010 – 2019
- 2017
- [j3]Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan de Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems:
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectron. Reliab. 74: 131-135 (2017) - [c2]Maaike Op de Beeck, Rik Verplancke, David Schaubroeck, Dieter Cuypers, Maarten Cauwe, Björn Vandecasteele, John M. O'Callaghan, Dries Braeken, Alexandru Andrei, Andrea Firrincieli, Marco Ballini, Aritra Kundu, Ahmed Fahmy, Erin E. Patrick, Nima Maghari, Rizwan Bashirullah, Johan de Baets:
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves. BioCAS 2017: 1-4 - 2014
- [c1]Jeroen van den Brand, Margreet de Kok, Ashok Sridhar, Maarten Cauwe, Rik Verplancke, Frederick Bossuyt, Johan de Baets, Jan Vanfleteren:
Flexible and stretchable electronics for wearable healthcare. ESSDERC 2014: 206-209
2000 – 2009
- 2008
- [j2]Jeroen van den Brand, Johan de Baets, T. van Mol, Andreas Dietzel:
Systems-in-foil - Devices, fabrication processes and reliability issues. Microelectron. Reliab. 48(8-9): 1123-1128 (2008) - 2005
- [j1]Sam Siau, Johan de Baets, André Van Calster, Leon Heremans, Sammy Tanghe:
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectron. Reliab. 45(3-4): 675-687 (2005)
Coauthor Index
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