"Characterization method of thermomechanical parameters for microelectronic ..."

Oliver Perat et al. (2002)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(02)00060-4

access: closed

type: Journal Article

metadata version: 2022-05-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/PeratDSBCPZT02
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/PeratDSBCPZT02
Oliver Perat, Jean-Marie Dorkel, Emmanuel Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, Patrick Tounsi:
Characterization method of thermomechanical parameters for microelectronic materials. Microelectron. Reliab. 42(7): 1053-1058 (2002)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.