"LTCC package for high temperature applications."

Damian Nowak, Andrzej Dziedzic (2011)

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DOI: 10.1016/J.MICROREL.2011.02.018

access: closed

type: Journal Article

metadata version: 2022-01-03

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Damian Nowak, Andrzej Dziedzic:
LTCC package for high temperature applications. Microelectron. Reliab. 51(7): 1241-1244 (2011)

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