"Effect of glue on reliability of flip chip BGA packages under thermal cycling."

Tung T. Nguyen et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.04.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park:
Effect of glue on reliability of flip chip BGA packages under thermal cycling. Microelectron. Reliab. 50(7): 1000-1006 (2010)

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