"Effect of high-speed loading conditions on the fracture mode of the BGA ..."

Jong-Woong Kim et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.066

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung:
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. Microelectron. Reliab. 48(11-12): 1882-1889 (2008)

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