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Sang-Su Ha

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2000 – 2009

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2008
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  - https://dblp.org/rec/journals/mr/KimJHHKJ08
Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung:
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. Microelectron. Reliab. 48(11-12): 1882-1889 (2008)

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