"A numerical procedure for simulating thermal oxidation diffusion of epoxy ..."

Zaifu Cui et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.112

access: closed

type: Journal Article

metadata version: 2020-02-22

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Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang:
A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectron. Reliab. 55(9-10): 1877-1881 (2015)

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