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"Power electronic assemblies: Thermo-mechanical degradations of gold-tin ..."

Faical Arabi et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.028

access: closed

type: Journal Article

metadata version: 2023-03-21

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Faical Arabi, Loic Théolier, Donatien Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard:
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. Microelectron. Reliab. 64: 409-414 (2016)

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