"Sequential combined thermal cycling and vibration test and simulation of ..."

Faical Arabi et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.050

access: closed

type: Journal Article

metadata version: 2020-02-22

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Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont:
Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectron. Reliab. 88-90: 768-773 (2018)

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