"Electrical modeling and characterization of through-silicon vias (TSVs) ..."

Ioannis Savidis et al. (2010)

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DOI: 10.1016/J.MEJO.2009.10.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ioannis Savidis, Syed M. Alam, Ankur Jain, Scott Pozder, Robert E. Jones, Ritwik Chatterjee:
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectron. J. 41(1): 9-16 (2010)

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