"An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s."

Ji-Young Kim et al. (2023)

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DOI: 10.1109/JSSC.2023.3285896

access: closed

type: Journal Article

metadata version: 2023-11-09

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  - https://dblp.org/rec/journals/jssc/KimKYKMSJ23
Ji-Young Kim, Taeryeong Kim, Jeonghyeok You, Ki-Ryong Kim, Byoung-Mo Moon, Kyomin Sohn, Seong-Ook Jung:
An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s. IEEE J. Solid State Circuits 58(11): 3242-3252 (2023)

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