"A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV ..."

Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri (2022)

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DOI: 10.1145/3517808

access: closed

type: Journal Article

metadata version: 2022-12-05

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Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri:
A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(4): 70:1-70:23 (2022)

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