"Algorithms for TSV resource sharing and optimization in designing 3D ..."

Byunghyun Lee, Taewhan Kim (2014)

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DOI: 10.1016/J.VLSI.2013.11.001

access: closed

type: Journal Article

metadata version: 2020-02-20

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Byunghyun Lee, Taewhan Kim:
Algorithms for TSV resource sharing and optimization in designing 3D stacked ICs. Integr. 47(2): 184-194 (2014)

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