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"Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin ..."
Caleb Serafy et al. (2016)
- Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi:
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks. IEEE Des. Test 33(2): 40-48 (2016)
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