"Filling the gap: thermal properties and device applications of graphene."

Rui Wu et al. (2021)

> Home

Details and statistics

DOI: 10.1007/S11432-020-3151-5

access: closed

type: Journal Article

metadata version: 2024-03-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/chinaf/WuZZZTR21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/chinaf/WuZZZTR21
Rui Wu, Rui-Zhi Zhu, Shi-Hui Zhao, Gang Zhang, He Tian, Tianling Ren:
Filling the gap: thermal properties and device applications of graphene. Sci. China Inf. Sci. 64(4) (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.