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ORCIDRui Wu 0016
Person information
- affiliation: Tsinghua University, Institute of Microelectronics and Beijing National Research Center for Information Science and Technology, Beijing, China
Other persons with the same name
- Rui Wu — disambiguation page
- Rui Wu 0001
![[0000-0001-7804-7691]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-7804-7691")
— Tokyo Institute of Technology, Tokyo, Japan - Rui Wu 0002 — Harbin Institute of Technology, Harbin, China
- Rui Wu 0003 — East Carolina University, Greenville, NC, USA
- Rui Wu 0004 — Hubei University of Technology, Wuhan, China
- Rui Wu 0005 — Tsinghua University, Department of Energy and Power Engineering, Beijing, China
- Rui Wu 0006 — Beijing Academy of Science and Technology, Institute of Urban Safety and Environmental Science, Beijing, China
- Rui Wu 0007 — Harbin Institute of Technology, State Key Laboratory of Robotics and Systems, Harbin, China
- Rui Wu 0008 — University of California, Santa Barbara, CA, USA
- Rui Wu 0009 — University of Illinois at Urbana-Champaign, Urbana, IL, USA
- Rui Wu 0010 — Ant Group, Hangzhou, China (and 1 more)
- Rui Wu 0011 — Chongqing University of Science and Technology, School of Electrical and Information Engineering, Chongqing, China
- Rui Wu 0012 — North China University of Technology, Beijing, China
- Rui Wu 0013 — Shanxi Xing'an Chemical Industry Company Ltd., Taiyuan, China
- Rui Wu 0014 — Shenzhen University, Guangdong Multimedia Information Service Engineering Technology Research Center, Shenzhen, China
- Rui Wu 0015 — Jiangxi University of Science and Technology, Ganzhou, China
- Rui Wu 0017 — Dalian Maritime University, Dalian, China
- Rui Wu 0018 — Horizon Robotics, Beijing, China
- Rui Wu 0019 — University of Massachusetts Lowell, Lowell, MA, USA
- Rui Wu 0020 — Google Brain, Google Research
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2020 – today
- 2021
[j1]Rui Wu, Rui-Zhi Zhu, Shi-Hui Zhao, Gang Zhang, He Tian, Tianling Ren:
Filling the gap: thermal properties and device applications of graphene. Sci. China Inf. Sci. 64(4) (2021)
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