"Power Semiconductor Devices and Packages: Solder Mechanical ..."

Michele Calabretta et al. (2021)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2021.3056281

access: open

type: Journal Article

metadata version: 2023-08-28

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/CalabrettaSOS21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/CalabrettaSOS21
Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia:
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction. IEEE Access 9: 22859-22867 (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.