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ORCIDMichele Calabretta
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2020 – today
- 2024
[c7]Francesco Rundo, Michele Calabretta, Michael Sebastian Rundo, Giulia Castagnolo, Carmelo Pino, Sebastiano Battiato, Angelo Alberto Messina:
Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field. MetroAutomotive 2024: 18-23- [c6]Francesco Rundo, Michele Calabretta
, Alessandro Sitta, Michael Sebastian Rundo, Sebastiano Battiato, Angelo Alberto Messina:
Deep Learning for Risk Assessment in Automotive Applications. MetroAutomotive 2024: 53-57 - 2023
- [j3]Carmelo Pino, Alessandro Sitta, Giulia Castagnolo, Angelo Alberto Messina, Salvatore Coffa, Michele Calabretta, Fabio Scotti, Angelo Genovese, Vincenzo Piuri, Concetto Spampinato, Francesco Rundo:
Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules. IEEE Trans. Intell. Veh. 8(12): 4734-4753 (2023) - [i1]Massimo Orazio Spata, Sebastiano Battiato, Alessandro Ortis, Francesco Rundo, Michele Calabretta, Carmelo Pino, Angelo Alberto Messina:
Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices. CoRR abs/2310.17657 (2023) - 2022
- [c5]Francesco Rundo, Angelo Alberto Messina, Michele Calabretta, Matteo Dilonardo, Salvatore Coffa, Concetto Spampinato:
Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System. IJCNN 2022: 1-9 - [c4]Marcello Cioni, Patrick Fiorenza, Fabrizio Roccaforte, Mario Saggio, Salvatore Cascino, Angelo Alberto Messina, Vincenzo Vinciguerra, Michele Calabretta, Alessandro Chini:
Identification of Interface States responsible for VTH Hysteresis in packaged SiC MOSFETs. IRPS 2022: 5 - 2021
- [j2]Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia:
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction. IEEE Access 9: 22859-22867 (2021) - [j1]Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia:
Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling. IEEE Access 9: 76307-76314 (2021)
2010 – 2019
- 2019
- [c3]Michele Calabretta, Marco Renna, Vincenzo Vinciguerra, Angelo Alberto Messina:
Power Packages Interconnections for High Reliability Automotive Applications. ESSDERC 2019: 35-39 - [c2]Marco Santopá, Sebastiano Russo, Marco Torrisi, Marco Renna, Alessandro Sitta, Michele Calabretta:
Fast transient thermomechanical stress to set a pressure-assisted sintering process. PRIME 2019: 61-64 - 2018
- [c1]Alessandro Sitta, Sebastiano Russo, Gaetano Bazzano, Daniela Cavallaro, Giuseppe Greco, Michele Calabretta:
Numerical approach to predict power device reliability. DTIS 2018: 1-5
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last updated on 2024-10-07 22:10 CEST by the dblp team
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