"A built-in self-test scheme for the post-bond test of TSVs in 3D ICs."

Yu-Jen Huang et al. (2011)

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DOI: 10.1109/VTS.2011.5783749

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-17

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Yu-Jen Huang, Jin-Fu Li, Ji-Jan Chen, Ding-Ming Kwai, Yung-Fa Chou, Cheng-Wen Wu:
A built-in self-test scheme for the post-bond test of TSVs in 3D ICs. VTS 2011: 20-25

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