"A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on ..."

Mu-Shan Lin et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631440

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type: Conference or Workshop Paper

metadata version: 2024-10-17

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Mu-Shan Lin, Chien-Chun Tsai, Shenggao Li, Tze-Chiang Huang, Wen-Hung Huang, Kate Huang, Yu-Chi Chen, Alex Liu, Yu-Jie Huang, Jimmy Wang, Shu-Chun Yang, Nai-Chen Cheng, Chao-Chieh Li, Hsin-Hung Kuo, Wei-Chih Chen, Chin-Hua Wen, Kevin Lin, Po-Yi Huang, Kenny Cheng-Hsiang Hsieh, Frank Lee:
A 0.296pJ/bit 17.9Tb/s/mm² Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4. VLSI Technology and Circuits 2024: 1-2

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