"Mechanical Stress Effects on Dielectric Leakage and Interconnection ..."

Sehoon Lee et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631518

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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Sehoon Lee, Jieun Lee, Sungpil Jang, Sujeong Kim, Choelgyu Kim, Narae Jeong Sae-Jin Kim, Jisoo Kang, Juhee Hong, Dong-Kyu Kim, Junhee Lim, Sejun Park, Seungwan Hong, Sunghoi Hur:
Mechanical Stress Effects on Dielectric Leakage and Interconnection Integrity in 3D NAND Flash Memory. VLSI Technology and Circuits 2024: 1-2

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