"Electrical and fluidic microbumps and interconnects for 3D-IC and silicon ..."

Li Zheng, Muhannad S. Bakir (2012)

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DOI: 10.1109/SOCC.2012.6398388

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Li Zheng, Muhannad S. Bakir:
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer. SoCC 2012: 159-164

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