"High-level TSV resource sharing and optimization for TSV based 3D IC designs."

Byunghyun Lee, Taewhan Kim (2013)

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DOI: 10.1109/SOCC.2013.6749680

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Byunghyun Lee, Taewhan Kim:
High-level TSV resource sharing and optimization for TSV based 3D IC designs. SoCC 2013: 153-158

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