"A Power-Efficient and High-Throughput Hardware Design for 3D-HEVC ..."

Murilo R. Perleberg et al. (2018)

> Home

Details and statistics

DOI: 10.1109/SBCCI.2018.8533257

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/sbcci/PerlebergACSAZP18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/sbcci/PerlebergACSAZP18
Murilo R. Perleberg, Vladimir Afonso, Ruhan A. Conceição, Altamiro Amadeu Susin, Luciano Volcan Agostini, Bruno Zatt, Marcelo Schiavon Porto:
A Power-Efficient and High-Throughput Hardware Design for 3D-HEVC Disparity Estimation. SBCCI 2018: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.