"Fault diagnosis of TSV-based interconnects in 3-D stacked designs."

Janusz Rajski, Jerzy Tyszer (2013)

> Home

Details and statistics

DOI: 10.1109/TEST.2013.6651894

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

- view
  authority control:
- export record
  dblp key:
  - conf/itc/RajskiT13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/itc/RajskiT13
Janusz Rajski, Jerzy Tyszer:
Fault diagnosis of TSV-based interconnects in 3-D stacked designs. ITC 2013: 1-9

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.