"Optimization methods for post-bond die-internal/external testing in 3D ..."

Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen (2010)

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DOI: 10.1109/TEST.2010.5699219

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen:
Optimization methods for post-bond die-internal/external testing in 3D stacked ICs. ITC 2010: 193-201

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