"Test-yield improvement of high-density probing technology using optimized ..."

Sen-Kuei Hsu et al. (2013)

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DOI: 10.1109/TEST.2013.6651888

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  - https://dblp.org/rec/conf/itc/HsuCHLLLPW13
Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang:
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. ITC 2013: 1-10

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