"On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC."

Sheng-Hsin Fang et al. (2017)

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DOI: 10.1109/ISVLSI.2017.86

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Sheng-Hsin Fang, Chang-Tzu Lin, Wei-Hsun Liao, Chien-Chia Huang, Li-Chin Chen, Hung-Ming Chen, I-Hsuan Lee, Ding-Ming Kwai, Yung-Fa Chou:
On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC. ISVLSI 2017: 459-464

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