"Thermal via placement in 3D ICs."

Brent Goplen, Sachin S. Sapatnekar (2005)

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DOI: 10.1145/1055137.1055171

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Brent Goplen, Sachin S. Sapatnekar:
Thermal via placement in 3D ICs. ISPD 2005: 167-174

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