"The need for a full-chip and package thermal model for thermally optimized ..."

Wei Huang et al. (2005)

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DOI: 10.1145/1077603.1077662

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

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Wei Huang, Eric Humenay, Kevin Skadron, Mircea R. Stan:
The need for a full-chip and package thermal model for thermally optimized IC designs. ISLPED 2005: 245-250

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