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"TSV repairing for 3D ICs using redundant TSV."

Sudeep Ghosh et al. (2017)

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DOI: 10.1109/ISED.2017.8303914

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/ised/GhoshRRG17
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  - https://dblp.org/rec/conf/ised/GhoshRRG17
Sudeep Ghosh, Surajit Kumar Roy, Hafizur Rahaman, Chandan Giri:
TSV repairing for 3D ICs using redundant TSV. ISED 2017: 1-5

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