"Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator ..."

Alper Kaan Soydan et al. (2019)

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DOI: 10.1109/SENSORS43011.2019.8956828

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Alper Kaan Soydan, Muhammed Berat Yuksel, Dilek Isik Akcakaya, Haluk Külah:
Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration. IEEE SENSORS 2019: 1-4

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