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Dilek Isik Akcakaya

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2010 – 2019

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2019
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Alper Kaan Soydan, Muhammed Berat Yuksel, Dilek Isik Akcakaya, Haluk Külah:
Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration. IEEE SENSORS 2019: 1-4

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