"Token3D: Reducing Temperature in 3D Die-Stacked CMPs through Cycle-Level ..."

Juan M. Cebrian, Juan L. Aragón, Stefanos Kaxiras (2011)

> Home

Details and statistics

DOI: 10.1007/978-3-642-23400-2_28

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/europar/CebrianAK11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/europar/CebrianAK11
Juan M. Cebrian, Juan L. Aragón, Stefanos Kaxiras:
Token3D: Reducing Temperature in 3D Die-Stacked CMPs through Cycle-Level Power Control Mechanisms. Euro-Par (1) 2011: 295-309

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.