"SPICE based SI-PI co-simulation Framework to optimize Die-Package-PCB to ..."

Rohit Halba, Pawan Kumar Gupta (2024)

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DOI: 10.1109/EMCCOMPO61192.2024.10742023

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-22

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Rohit Halba, Pawan Kumar Gupta:
SPICE based SI-PI co-simulation Framework to optimize Die-Package-PCB to meet LPDDR5(x) Performance in Automotive and Edge MPU-MCU. EMC Compo 2024: 1-4

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