"Non-hermetic encapsulation for implantable electronic devices based on epoxy."

Fabian Boeser et al. (2015)

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DOI: 10.1109/EMBC.2015.7318485

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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Fabian Boeser, Juan S. Ordonez, Martin Schuettler, Thomas Stieglitz, Dennis T. T. Plachta:
Non-hermetic encapsulation for implantable electronic devices based on epoxy. EMBC 2015: 809-812

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