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ORCIDJuan S. Ordonez
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2010 – 2019
- 2018
[c16]Sharif Khan, Daniel Scholz, Juan S. Ordonez, Thomas Stieglitz
:
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices. EMBC 2018: 2941-2944- 2017
- [j2]Marie T. Alt, Eva Fiedler, Linda Rudmann, Juan S. Ordonez, Patrick Ruther, Thomas Stieglitz:
Let There Be Light - Optoprobes for Neural Implants. Proc. IEEE 105(1): 101-138 (2017) - [j1]Stefan B. Rieger, Jennifer Pfau, Thomas Stieglitz, Maria Asplund, Juan S. Ordonez:
Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In Vivo. Sensors 17(1): 59 (2017) - [c15]Jennifer Pfau, Thomas Stieglitz, Juan S. Ordonez:
Mechanical deformation and chemical degradation of thin-film platinum under aging and electrical stimulation. NER 2017: 166-169 - [c14]Sharif Khan, Juan S. Ordonez, Thomas Stieglitz:
Dual-sided process with graded interfaces for adhering underfill and globtop materials to microelectrode arrays. NER 2017: 247-250 - [c13]Maria Vomero, Elisa Castagnola, Juan S. Ordonez, Stefano Carli, Elena Zucchini, Emma Maggiolini, Calogero Gueli, Noah Goshi, Luciano Fadiga, Davide Ricci, Sam Kassegne, Thomas Stieglitz:
Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon. NER 2017: 288-291 - 2015
- [c12]Julia Koch, Juan S. Ordonez, Thomas Stieglitz, Martin Schuettler:
Development of a multichannel implantable connector. EMBC 2015: 805-808 - [c11]Fabian Boeser, Juan S. Ordonez, Martin Schuettler, Thomas Stieglitz, Dennis T. T. Plachta:
Non-hermetic encapsulation for implantable electronic devices based on epoxy. EMBC 2015: 809-812 - [c10]Juan S. Ordonez, Linda Rudmann, Paul Cvancara, Christian Bentler, Thomas Stieglitz:
Mechanical deformation of thin film platinum under electrical stimulation. EMBC 2015: 1045-1048 - [c9]D. Ashouri Vajari, Juan S. Ordonez, L. Furlanetti, M. Dobrossy, Volker A. Coenen, Thomas Stieglitz:
Hybrid multimodal Deep Brain probe (DBS array) for advanced brain research. NER 2015: 280-283 - 2014
- [c8]Fabian Kohler, Patrick Kiele, Juan S. Ordonez, Thomas Stieglitz, Martin Schuettler:
A polymer-metal two step sealing concept for hermetic neural implant packages. EMBC 2014: 3981-3984 - [c7]Juan S. Ordonez, Victor Pikov, Harvey Wiggins, Craig Patten, Thomas Stieglitz, J. Rickert, Martin Schuettler:
Cuff electrodes for very small diameter nerves - Prototyping and first recordings in vivo. EMBC 2014: 6846-6849 - 2012
- [c6]Juan S. Ordonez, Philip Dautel, Martin Schuettler, Thomas Stieglitz:
Hermetic glass soldered micro-packages for a vision prosthesis. EMBC 2012: 2784-2787 - [c5]Juan S. Ordonez, Martin Schuettler, Maurits Ortmanns, Thomas Stieglitz:
A 232-channel retinal vision prosthesis with a miniaturized hermetic package. EMBC 2012: 2796-2799 - [c4]Martin Schuettler, Fabian Kohler, Juan S. Ordonez, Thomas Stieglitz:
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication. EMBC 2012: 3886-3889 - [c3]Juan S. Ordonez, Christian Böhler, Martin Schuettler, Thomas Stieglitz:
Improved polyimide thin-film electrodes for neural implants. EMBC 2012: 5134-5137 - 2011
- [c2]Martin Schuettler, Andreas Schatz, Juan S. Ordonez, Thomas Stieglitz:
Ensuring minimal humidity levels in hermetic implant housings. EMBC 2011: 2296-2299 - [c1]Juan S. Ordonez, Christian Böhler, Martin Schuettler, Thomas Stieglitz:
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes. EMBC 2011: 2953-2956
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