"An efficient leakage-aware thermal simulation approach for 3D-ICs using ..."

Chao Yan et al. (2017)

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DOI: 10.23919/DATE.2017.7927172

access: closed

type: Conference or Workshop Paper

metadata version: 2017-08-14

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  persistent URL:
  - https://dblp.org/rec/conf/date/YanZZZ17
Chao Yan, Hengliang Zhu, Dian Zhou, Xuan Zeng:
An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid. DATE 2017: 1207-1212

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