"TSV redundancy: Architecture and design issues in 3D IC."

Ang-Chih Hsieh et al. (2010)

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DOI: 10.1109/DATE.2010.5457218

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Ang-Chih Hsieh, TingTing Hwang, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li:
TSV redundancy: Architecture and design issues in 3D IC. DATE 2010: 166-171

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