"On effective and efficient in-field TSV repair for stacked 3D ICs."

Li Jiang et al. (2013)

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DOI: 10.1145/2463209.2488824

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-21

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Li Jiang, Fangming Ye, Qiang Xu, Krishnendu Chakrabarty, Bill Eklow:
On effective and efficient in-field TSV repair for stacked 3D ICs. DAC 2013: 74:1-74:6

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