"FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D ..."

Takeshi Ohkawa, Masahiro Aoyagi (2023)

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DOI: 10.1109/COOLCHIPS57690.2023.10122025

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-22

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Takeshi Ohkawa, Masahiro Aoyagi:
FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D Standard Chip Stacking System. COOL CHIPS 2023: 1-3

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