"A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver ..."

Andrew Townley et al. (2020)

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DOI: 10.1109/CICC48029.2020.9075890

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-23

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Andrew Townley, Nima Baniasadi, Sashank Krishnamurthy, Constantine Sideris, Ali Hajimiri, Elad Alon, Ali M. Niknejad:
A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link. CICC 2020: 1-4

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