"A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell ..."

Matheus Trevisan Moreira et al. (2023)

> Home

Details and statistics

DOI: 10.1109/ASYNC58294.2023.10239556

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-01

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/async/MoreiraKWSB23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/async/MoreiraKWSB23
Matheus Trevisan Moreira, William Koven, Tony F. Wu, Huseyin Ekin Sumbul, Edith Beigné:
A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries. ASYNC 2023: 58-59

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.