"T-Fusion: Thermal Modeling of 3D ICs with Multi-fidelity Fusion."

Bingrui Zhang et al. (2025)

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DOI: 10.1145/3658617.3697749

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-07

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Bingrui Zhang, Wei Xing, Xin Zhao, Yuquan Sun:
T-Fusion: Thermal Modeling of 3D ICs with Multi-fidelity Fusion. ASP-DAC 2025: 1406-1412

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