"O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs."

Xingyu Tong et al. (2024)

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DOI: 10.1109/ASP-DAC58780.2024.10473921

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Xingyu Tong, Zhijie Cai, Peng Zou, Min Wei, Yuan Wen, Zhifeng Lin, Jianli Chen:
O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs. ASPDAC 2024: 71-76

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