"Advanced Packaging Technology and Design Methodology for Next Generation ..."

Hideki Sasaki (2025)

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DOI: 10.1145/3658617.3703321

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-07

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Hideki Sasaki:
Advanced Packaging Technology and Design Methodology for Next Generation Chiplets. ASP-DAC 2025: 1144

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