"High-density integration of functional modules using monolithic 3D-IC ..."

Shreepad Panth et al. (2013)

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DOI: 10.1109/ASPDAC.2013.6509679

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC 2013: 681-686

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