"3D Vertical RRAM Array and Device Co-design with Physics-based Spice Model."

Weiiie Xu et al. (2019)

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DOI: 10.1109/ASICON47005.2019.8983496

access: closed

type: Conference or Workshop Paper

metadata version: 2020-02-12

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Weiiie Xu, Yudi Zhao, Peng Huang, Xiaoyan Liu, Jinfeng Kang:
3D Vertical RRAM Array and Device Co-design with Physics-based Spice Model. ASICON 2019: 1-4

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